GUC taps on AI / HPC / network platform on TSMC CoWoS® technology
Global Unichip Corp. (GUC), the leader in advanced ASICs, today announced that it has successfully implemented the CoWoSÂ® AI / HPC / Networking platform with a 7.2 Gbps HBM3 controller and PHY, GLink- 2.5D and 112G-LR IP third-party services. The main matrix of the platform contains the world’s first HBM3 controller and a PHY IP address with record performance of 7.2 Gbit / s. The platform meets the stringent signal and power (SI and PI) integrity requirements of the 112G-LR SerDes routed via TSMC CoWoS technologies. GUC’s GLink-2.5D interface enables high bandwidth, low latency, low power interconnection of multiple chips on the CoWoS platform.
The success of bandwidth exceeds memory bandwidth limits and unleashes new potential for scalable artificial intelligence (AI), high performance computing (HPC) and multi-die networking solutions.
The platform represents true use cases of IA / HPC / network applications that require the high flexibility of SoC floor plans and HBM3 PHY / controller layouts on the main chip versus HBM3 memory on the interposer . GUC’s patent pending solution allows HBM3 bus routing between PHY and memory at any angle, while maintaining the same signal width and space as in traditional straight HBM bus routing. It provides shorter routing, better signal integrity, higher speed, and lower power consumption than traditional HBM zig-zag bus routing.
GUC products can support up to 10 HBM3 memories connected to two SoC chips using division PHY technology. The company’s patent pending solution splits the central HBM3 memory bus into PHYs, located on two SoC chips to allow full use of HBM3 in SoC memory use cases: HBM3 2: 6 or 2:10 .
GUC’s design for CoWoS and Interposer supports 112G-LR SerDes signaling by adopting an internal interposer design flow and the latest TSMC CoWoS technology. To represent typical AI / HPC / network chip conditions, multiple instances of IP HBM3, 112G-LR SerDes and GLink-2.5D have been integrated into this large, high power CoWoS platform. GUC implemented a high coverage DFT solution for production testing at the wafer and final production level. The DFT solution takes advantage of the redundancy and repair of the HBM3 and GLink-2.5D channels to maximize CoWoS throughput.
âWe are proud to be the first company in the world to create a full-scale 7.2 Gbps HBM3 controller and IP PHY. GUC has once again demonstrated its leadership in the industry by offering a complete solution for advanced packaging technology, âsaid Dr. Ken Chen, President of GUC. âWe have supplemented our HBM2E PHY / Controller, GLink-2.5D and GLink-3D IP portfolio with HBM3. Together with CoWoS, InFO_oS, 3DIC design expertise, packaging design, electrical and thermal simulations, DFT and production testing, we provide cutting edge solutions to our customers and help them achieve even more success in their products and activities.
âWe integrated multiple instances of HBM3, 112G-LR SerDes and GLink-2.5D IP and very complex failover logic into a 280mm2, 400W chip and assembled multiple HBM3 chips and memories on a CoWoS platform. It validates our IPs under AI / HPC / large-scale network chip conditions and brings the great confidence of the robust operation of our IPs to large-scale products. Said Igor Elkanovich, Technical Director of GUC. âWe used our expertise in designing 112 Gbps multichannel packages and a silicon-correlated high-speed interposer design flow to validate 112 Gbps on the latest CoWoS solution. “
Main features of the GUC CoWoS AI / HPC / network platform:
- World’s 1st fully functional HBM3 controller and 7.2 Gbps PHY
- The interposer and the CoWoS package meet the stringent requirements of 112G-LR SerDes
- GLink-2.5D interface connecting several dies on CoWoS
- Single 280mm2 die with configurable 400W power consumption and multiple die assembly on CoWoS with HBM3 memories
- GUC’s patent pending interposer routing to support any angle zigzag routing and split HBM3 PHY into two SoC uses
- Complete DFT solution for wafer testing and final testing of assembled dies, including redundancy and repair of HBM3 and GLink-2.5D channels
To learn more about GUC’s HBM3 / 2E, GLink-2.5D / 3D IP Wallet and InFO / CoWoS / 3DIC total solution, please contact your GUC sales representative directly or email guc_sales @ guc-asic. com
GLOBAL UNICHIP CORP. (GUC) is the advanced ASIC leader providing the semiconductor industry with state-of-the-art integrated circuit implementation and SoC manufacturing services, using state-of-the-art process and packaging technology. Based in Hsin-Chu, Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea and North America. GUC is listed on the Taiwan Stock Exchange under the symbol 3443. For more information, visit https://www.guc-asic.com